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February 2006

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Subject:
From:
John Berg <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Berg <[log in to unmask]>
Date:
Tue, 28 Feb 2006 12:44:27 -0600
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If x-ray is not an option, you need to set up a soldering process that would not require inspection. On a thermally relieved pad that does not get sufficient fill, you need to preheat the pad area prior to hand soldering to compensate for the heat sinking. If you can get a dummy populated board, preheat it to a known reference level, and then remove the connector body to examine the % fill. Find the minimum reference preheat that will obtain your desired % fill. If you can't get a dummy populated board, you can use a few production boards to find the reference preheat by utilizing an ouitside x-ray service to determine the % fill.

>>> [log in to unmask] 2/28/2006 7:55 AM >>>
We are having a heck of a time inspecting some solder joints and could
use your help.

Per Class 3 a solder joint is supposed to have at least a 75% fill. We
have a circuit board that has large ground planes and hand soldered
connectors that are impossible to inspect for top side solder.

We do not have access to an x-ray and are wondering if there are any
clever ways to inspect these solder joints.

Thanks,

KennyB

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