Happy Holden,

Hello.
The Selectron paper on HD VIP sounds interesting. How/where can I obtain a
copy?

Thanks
joe

-----Original Message-----
From: Happy Holden [mailto:[log in to unmask]] 
Sent: Friday, February 24, 2006 1:26 PM
To: [log in to unmask]
Subject: Re: [TN] Via in Pad x Voids on Solder Process

Marcello,
Is this voids in the solder paste after assembly or voids in the board for 
the sequential laminations?  Have you seen the Solectron paper on HDI VIP 
voids as a function of blind-via placement and final finish?
Happy Holden
Asian Pacific Materials



Marcello Brett Malteze <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
02/24/2006 03:40 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Marcello Brett Malteze <[log in to unmask]>


To
[log in to unmask]
cc

Subject
[TN] Via in Pad x Voids on Solder Process






Hey Team,

 

 

    We are facing some problems regarding voids on Via in Pad on a 10 
layers

board with sequential lamination ( 3 times inside press) on BGA area ,

someone can give me light or share your experience on this?

 

Board Spec:

 

Dielectric 2 x 106 = 90 - 100 µm final

YAG machine

O/L Copper 12 µm

Laser Diameter 130 µm

Surface finish Immersion Tin

 

Sometimes Voids are so big that are creating shorts under BGA.

 

Marcello Brett Malteze 

Mechanical Process Engineering 

Mobile: + 55 11 9468 4833 

Skype: mbrett73 





Legal Disclaimer:

The information contained in this message may be privileged and 
confidential. It is intended to be read only by the individual or entity 
to whom it is addressed or by their designee. If the reader of this 
message is not the intended recipient, you are on notice that any 
distribution of this message, in any form, is strictly prohibited. If you 
have received this message in error, please immediately notify the sender 
and delete or destroy any copy of this message


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to 
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to 
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 
for additional information, or contact Keach Sasamori at [log in to unmask] or 
847-615-7100 ext.2815
-----------------------------------------------------


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------