I am using it to mount some chip packages and leds due to specific
requirement stated by customer.
I plan to use 7mils stencil?Somehow,will Ag epoxy with equal bonding
strength as solder after reflow?
thanks.sumxp
----- Original Message -----
From: "Lee parker" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Sunday, February 26, 2006 12:23 AM
Subject: Re: [TN] Printing Ag epoxy


> What is the application?
>
> If you are trying
> Smxp
>
> What is the application?
>
> If you are trying to fill vias this is normally done after forming only
the holes to be filled and consequently a stencil is unnecessary and would
increase the aspect ratio of the hole to be filled.
>
> Best regards
>
> Lee
>
> J. Lee Parker, Ph.D.
> JLP Consultants LLC
> 804 779 3389
>
>
>
> ----- Original Message -----
>   From: sumxp<mailto:[log in to unmask]>
>   To: [log in to unmask]<mailto:[log in to unmask]>
>   Sent: Saturday, February 25, 2006 4:53 AM
>   Subject: [TN] Printing Ag epoxy
>
>
>   Hi,
>
>   Anyone had experiance in using solder paste printer to print Ag epoxy on
>   pcb?Is it doable?What is the right viscosity on Ag to perform Ag
printing
>   process?
>
>   Thanks.sumxp
>
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