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February 2006

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Subject:
From:
Lee parker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lee parker <[log in to unmask]>
Date:
Sat, 25 Feb 2006 11:23:43 -0500
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What is the application?

If you are trying
Smxp



What is the application? 



If you are trying to fill vias this is normally done after forming only the holes to be filled and consequently a stencil is unnecessary and would increase the aspect ratio of the hole to be filled.



Best regards



Lee



J. Lee Parker, Ph.D.

JLP Consultants LLC

804 779 3389







----- Original Message ----- 

  From: sumxp<mailto:[log in to unmask]> 

  To: [log in to unmask]<mailto:[log in to unmask]> 

  Sent: Saturday, February 25, 2006 4:53 AM

  Subject: [TN] Printing Ag epoxy





  Hi,



  Anyone had experiance in using solder paste printer to print Ag epoxy on

  pcb?Is it doable?What is the right viscosity on Ag to perform Ag printing

  process?



  Thanks.sumxp



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