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February 2006

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Subject:
From:
Marcello Brett Malteze <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Marcello Brett Malteze <[log in to unmask]>
Date:
Fri, 24 Feb 2006 17:40:39 -0300
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text/plain (61 lines)
Hey Team,


 


 


    We are facing some problems regarding voids on Via in Pad on a 10 layers


board with sequential lamination ( 3 times inside press) on BGA area ,


someone can give me light or share your experience on this?


 


Board Spec:


 


Dielectric 2 x 106 = 90 - 100 µm final


YAG machine


O/L Copper 12 µm


Laser Diameter 130 µm


Surface finish Immersion Tin


 


Sometimes Voids are so big that are creating shorts under BGA.


 


Marcello Brett Malteze 


Mechanical Process Engineering 


Mobile: + 55 11 9468 4833 


Skype: mbrett73 








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