Hi all, Been some time since I posted here. Anyway, I'm wondering if
anyone here has fanned out a BGA with more than 1 trace from a ball pad?
What I have done is group several pads to each other and to vias which
makes a pattern like a number 5 on a dice in order to make room under
the board for pads on caps. I don't have the option for blind or buried
vias and I'm looking at a .010" drilled via in a .094" thick board. My
concern is not a noise problem, (the engineer is the one wanting the
caps and grounds like I have them) but more of an assembly concern. Will
the multiple traces from the pads cause a reflow problem when installing
the BGA? Any ideas or help would be great on this.
Thanks.


Scott Decker
AKA: Padmasterson
Broad Reach Engineering CAE
Tempe, AZ.


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