Scott, a few causes: not in any order
1. Over etched - too long of an etch cycle
2. Plating issues--Copper bath contaminated-tin or solder overplate
bath out of whack
3. Resist break down due to hydroxils formed at the outermost edges
of the circuits (poor presist application or cleanliness prior to
resist application)

Just a few common causes listed above. What is the weight of the base
copper and the trace widths involved?



At 12:33 PM 02/23/2006, you wrote:
>All you board gurus out there, I have a question for you.
>    What are the reason(s) I see traces that look like a mouse has
>nibbled on the copper to etch it, as opposed to acid etching the copper?
>I'm looking at some boards that look like the resist was put on by a
>drunk with an old marker pen! The vias are not even round and the SMD
>lands have ragged edges also. This shop is off my list from here on out
>and going to be rebuilding some boards due to minimum trace problems
>too, but can anyone tell me what causes the ragged edges like that? I
>understand that specs are looking at averages, which means a high and
>low end of the spectrum. I think I know who put the low numbers into the
>pot. :-(
>Thanks for any info.
>
>Scott Decker
>AKA: Padmasterson
>Broad Reach Engineering CAE
>Ph. 480-377-0400 Ext. 34
>FAX. 480-968-4597
>Tempe, AZ.
>
>
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