Jack Crawford, IOM
IPC Director Certification and Assembly Technology
[log in to unmask]
847-597-2893
FAX 847-615-5693
3000 Lakeside Drive, Suite 309 S
Bannockburn, IL, 60015
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Amol (349)
Sent: Friday, February 17, 2006 1:32 PM
To: [log in to unmask]
Subject: Re: [TN] Big Holes (no Pun intended) in the IPC610D Criteria
for Shrink/tear holes
Will post the pictures when I get the cross sections... the image I see
under the scope is EXACTLY the same as given in the IPC Criteria...the
usefulness of that criteria starts and ends right there!
Amol Kane
M.S (Industrial Eng.)
Process Engineer
Harvard Custom Manufacturing
941 Route 38 Owego, NY 13827
Phone: (607) 687-7669 x349
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon
Sent: Friday, February 17, 2006 2:00 PM
To: [log in to unmask]
Subject: Re: [TN] Big Holes (no Pun intended) in the IPC610D
Criteria for Shrink/tear holes
Hi Kane:
Send some pictures to Stevo so he can place them
on his wall, for all to see what the issue is, a picture is worth a
thousand words. It might wake Steve up. He has been so quiet for so
long.
Regards,
Ramon
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Friday, February 17, 2006 1:19 PM
To: [log in to unmask]
Subject: Re: [TN] Big Holes (no Pun intended) in the IPC610D Criteria
for Shrink/tear holes
Amol,
I am not sure you are going to get a definitive answer to that given the
IPC document shortfall.
I suspect that over the next 6 months your e-mail may be the tip of a
lead-free solder joint quality Ice Berg.
John
John Burke
Senior Manager - Operations , Optichron
[log in to unmask]
W: 510 249 5233
M: 408 515 4992
http://www.optichron.com
Profile: https://www.linkedin.com/e/fps/2665502/
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Amol (349)
Sent: Friday, February 17, 2006 10:08 AM
To: [log in to unmask]
Subject: [TN] Big Holes (no Pun intended) in the IPC610D Criteria for
Shrink/tear holes
Dear Technetters,
I have Immersion Ag and Immersion Sn LF boards that were waved using
SAC305 alloy. I have a lot of tears/shrink voids in the waved
connections. I am aware that SAC305 in wave has a propensity of shrink
tears/voids due to the non eutectic property of SAC.
IPC 610 Rev D 5.2.11 says that as long as the bottom of the tear is
visible, and the tear does not contact any lead land or barrel wall, it
is acceptable. My issue is that clearly IPC did not put any thought in
this statement. For starters, what magnification should I use for
inspection of this tear? The physical appearance of these tears is such
that it is impossible to be able to see the bottom (they branch out
inside in a zigzag manner, and are seldom just straight down). The
location of these tears may prove conductive to crack propagation during
thermal cycling.
In view of this uncertainty, how do I pass these joints and ship the
boards (Currently, I am in the process of x-sectioning the joints to
determine the distribution and extent of these cracks in the solder to
gather more info and pass/fail the boards based on it)
Any thoughts everybody???
Regards,
Amol Kane
M.S (Industrial Eng.)
Process Engineer
Harvard Custom Manufacturing
941 Route 38 Owego, NY 13827
Phone: (607) 687-7669 x349
[log in to unmask]
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