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Date: | Thu, 16 Feb 2006 12:31:12 EST |
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Actually, embedded active components is becoming a rather hot topic,
especially in Europe and Japan. Europe has research programs, focused at the
Fraunhofer Institute in Berlin on both embedding active silicon devices in laminate
- "Hiding Dies", and in flex - "Project Shift". In Japan, embedded active
silicon has been forecast in the last two JISSO roadmaps.
IPC is allowing place holders now in rigid board specifications for
"Embedded Actives", in addition to significant standards work on "Embedded Passives".
One intriguing thought is around the "Formed Component" and "Placed
Component" inside the board. Mostly, we are familiar with "formed" embedded passives
made by etching, printing or plating something on the innerlayer. However,
much work is now going on to "place" very small discrete passive resistors
and capacitors on innerlayers and then laminate or mold the rest of the PWB
package around them.
We think of "placing" active silicon die inside the package - flip chip,
etc. However, there is the concept to "form" the IC by using organic
semiconductor compounds to achieve a simple integrated circuit. Perhaps, RFID tags
that use organic semiconductor compounds, screen printed or inkjetted in place,
will be the first of the "embedded formed" active components. iNEMI has just
formed a "printed electronics" committee to follow this activity.
Perhaps this is wandering - please contact me off line if I can help further
with these concepts.
Denny Fritz
MacDermid, Inc
Chairman, Group 3 of JISSO International Committee - Embedded Components.
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