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February 2006

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Subject:
From:
"Kane, Amol (349)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Kane, Amol (349)
Date:
Thu, 16 Feb 2006 09:11:38 -0500
Content-Type:
text/plain
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text/plain (89 lines)
Dear TechNetters,
A question was recently asked by a customer whether we have a "Zero Emissions Spray Booth" for conformal coating applications. We spray polyurethane, acrylic, epoxy and silicon coatings. We have an exhaust type spray booth to remove harmful vapors from the coating room. Can anyone shed some light on the Zero Emissions Spray Booth concept so that I can evaluate our existing infrastructure against the requirements and make upgrades if necessary.

Thanks in advance,

Amol Kane
M.S (Industrial Eng.)
Process Engineer
Harvard Custom Manufacturing 
941 Route 38  Owego, NY 13827
Phone: (607) 687-7669 x349
[log in to unmask]

 -----Original Message-----
From:   TechNet [mailto:[log in to unmask]]  On Behalf Of Dehoyos, Ramon
Sent:   Thursday, February 16, 2006 8:33 AM
To:     [log in to unmask]
Subject:        Re: [TN] BGA Reflow profile - Thermocouples

        Hi Dominic:
        It should not cost you much to find out what is the temperature
of a board through reflow. The investment of buying a Mole or other
similar device, that will allow you to record the profile of a board
through an oven is only "once". If you are using eutectic solder and
your coldest components sees 20 degrees over the melting point which is
203 C  and you are not exceeding the highest temp that the most
sensitive component may withstand, then you have a working profile, that
simple.
        Regards,
        Ramon

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dominic Boudreau
Sent: Wednesday, February 15, 2006 5:50 PM
To: [log in to unmask]
Subject: [TN] BGA Reflow profile - Thermocouples

Hello Techneter's,

I am working on a procedure to make the reflow profile of a PCB.

What are the techniques to know where to attach the thermocouples on the
"PCB"? I already know that it should be where we have the coldest and
hottest spot but is it possible to know when we "must" test a BGA to
have a better reflow profile. We are a little company so we don't have
the money to test a BGA each time we have one on a PCB.   

 

Thank you

 

 


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