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February 2006

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Subject:
From:
"Dehoyos, Ramon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dehoyos, Ramon
Date:
Thu, 16 Feb 2006 08:32:34 -0500
Content-Type:
text/plain
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text/plain (60 lines)
        Hi Dominic:
        It should not cost you much to find out what is the temperature
of a board through reflow. The investment of buying a Mole or other
similar device, that will allow you to record the profile of a board
through an oven is only "once". If you are using eutectic solder and
your coldest components sees 20 degrees over the melting point which is
203 C  and you are not exceeding the highest temp that the most
sensitive component may withstand, then you have a working profile, that
simple.
        Regards,
        Ramon

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dominic Boudreau
Sent: Wednesday, February 15, 2006 5:50 PM
To: [log in to unmask]
Subject: [TN] BGA Reflow profile - Thermocouples

Hello Techneter's,

I am working on a procedure to make the reflow profile of a PCB.

What are the techniques to know where to attach the thermocouples on the
"PCB"? I already know that it should be where we have the coldest and
hottest spot but is it possible to know when we "must" test a BGA to
have a better reflow profile. We are a little company so we don't have
the money to test a BGA each time we have one on a PCB.   

 

Thank you

 

 


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