Lee,
There is a Japanese test method available, which I do not have.  I seem
to recall the method requires the component to be at a 45 degree angle
and the individual leads are pulled (or peeled as Werner describes)
using a wire hook. It is not specific to tin/lead.  In terms of
specifications, there are certainly no public ones in the western world,
although, again, there may be a Japanese one.  Nortel certainly had an
internal one when it was still a manufacturer.

Bev
RIM

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee Whiteman
Sent: February 2, 2006 5:55 PM
To: [log in to unmask]
Subject: [TN] GULL WING LEAD PULL TESTING

Is anyone aware of the specifications and test methods (JEDEC, IPC,
NASA,
etc) for Tin Lead (SnPb) soldered gull wing lead pull testing?

Specifically, is there any data regarding pull testing with ENIG
finished
circuit boards?

Lee Whiteman
Senior Manufacturing Engineer
American Competitiveness Institute
E-Mail: [log in to unmask]
Ph: (610) 362-1200 x208
Fax: (610) 362-1290

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