Hi Lee,
No, there are no pull test specification. And there is a good reason none
exists.
First, there cannot be such thing as a real 'lead pull test;' while you are,
of course, pulling on the lead, what you are doing to the solder joint is
peeling it--the proper reference is a lead peeling test.
Second, the solder joint strength, as determined by a lead peeling test, has
no bearing on the reliability of the solder joint, provided the peeling test
does not reveal inadequate wetting or poor metalization, e.g., 'Black Pad.
Third, in a peeling test you always need to observe the whole peel-load
history for the whole peeling process; with a 1T or larger heel fillet, the largest
load will be at the initial portion of peeling through the heel fillet, with
lower loads subsequently depending on whether or not (or to what extent) side
fillets are present.
Fourth, the fracture surface of the peeled solder joints give typically more
information than do the peel-load histories, because the ONLY really important
finding is whether or not adequate wetting has taken place, i.e. the
separation is mostly in the solder vs. being interfacial.
Fifth, the reliability in actual use does to a large extent depend on the
heel fillet and the 'bottom flat' wetting; if the foot length is <3W, than also
on the presence of a toe fillet, because short feet 'rock' during thermal
cycling. Side fillets are less important, unless you have wetting problems.

However, from your question it appears that you are more interested in the
behavior of ENIG metallization SJs. Ball shear tests indicate that shear test
values for SJs to Ni [ENIG] are about half those for SJs to Cu. See recent
e-mail be John Burke.

Werner

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