Is anyone aware of the specifications and test methods (JEDEC, IPC, NASA,
etc) for Tin Lead (SnPb) soldered gull wing lead pull testing?

Specifically, is there any data regarding pull testing with ENIG finished
circuit boards?

Lee Whiteman
Senior Manufacturing Engineer
American Competitiveness Institute
E-Mail: [log in to unmask]
Ph: (610) 362-1200 x208
Fax: (610) 362-1290

This message is for informational purposes only and does not supersede,
modify, or create any agreements with ACI. Information contained in this
message does not bind ACI or its affiliates to any commitment, either
express or implied, unless ratified in writing by an authorized
representative.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------