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Date: | Tue, 7 Feb 2006 10:19:18 EST |
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Hello -
We will be starting a new focus topic at the Thursday meeting of 5-23d
Committee - Alternate Final Board Finishes Task Group. That meets at 3:15 on
Thursday in Room 208A at Expo/Apex.
We are looking to develop standard testing to measure solderablity of all
board finishes, particularly after stress - storage, heat, humidity, etc. Our
task group inputs to the J-003 Board Solderablity Standards Committee.
Issues may come up including:
A standard dot method for all finishes would be desireable, if possible.
Is there a “standard solder paste”? that can be used
Slump versus spread + hot slump method
Possibly create an “index” for paste spread
Evaluation of paste/finish combination
Collect information on spread – possible round table in future.
If you cannot attend, all comments on the possible test methodology would be
appreciated.
Dennis Fritz, MacDermid
Committee Chairman - 5-23d Alt Finishes
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