Dear all of you experts out there,
Since whisker on tin plating is suspected to be caused by unrelieved compression
stress, besides annealing as stress relieving action, how about subjecting
plated IC packages strips after plating to ultrasonic agitation ? I heard
ultrasonic agitation is also one of the stress relieving techniques.
Regards,
I PD Wiska Susetio
Omedata Electronics - Indonesia
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