LEADFREE Archives

February 2006

Leadfree@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
IPD Wiska Susetio <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Fri, 10 Feb 2006 14:40:52 +0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (20 lines)
Dear all of you experts out there,

Since whisker on tin plating is suspected to be caused by unrelieved compression
stress, besides annealing as stress relieving action, how about subjecting
plated IC packages strips after plating to ultrasonic agitation ? I heard
ultrasonic agitation is also one of the stress relieving techniques.

Regards,

I PD Wiska Susetio
Omedata Electronics - Indonesia

-------------------------------------------------------------------------------Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop/(start) delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL/(MAIL)
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-------------------------------------------------------------------------------

ATOM RSS1 RSS2