Hi, Dominic, Werner, IPC LF Listservers,

I am glad Werner replied.

Hopefully I am writing the following correctly. Werner, JeanC, GGrossman,
others can correct me. SnPb has been good to us in electronics. The failure
mechanism, of most importance, has normally been in the solder and due to
creep as Werner has written. This has also been very good for accelerated
thermal cycle testing as a life predictor since it exercises this aspect.

From what I have read it appears that we will be experiencing new "quite
normal/ordinary" failures that will now be in other places than within the
solder. The higher strength and lower compliance (harder stretching {think
rubber bands that are aging}) of these LF solders should yield more
failures for certain applications that are not in the solder.


Yours in Engineering, Dave
YiEngr, MA/NY DDave

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