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February 2006

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Subject:
From:
Lester Subrattee <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 22 Feb 2006 10:57:46 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (116 lines)
Hi Jean-Paul,

Excellent closing point
But can we focus on that aspect and predict reliability with some degree of
confidence, given that the creep models are still in a bit of flux.
Today, in order to meet the deadlines.

Regards,
LS



 -----Original Message-----
From:   [log in to unmask] [mailto:[log in to unmask]]
Sent:   Tuesday, February 21, 2006 9:00 PM
To:     [log in to unmask]
Subject:        Re: Accelerated testing

Hi Werner,
I agree. There are two things going on for SAC and SnPb assemblies  subject
to the same thermal cycle:

1) SAC and SnPb see entirely different stress/strain histories (and
different strain rates at any given time) because they have different
thermo-mechanical characteristics: SAC is more creep resitant than SnPb
under  low to medium
stress; SAC creeps faster under high stress; last, at   a given temperature,
SAC is always stiffer than SnPb (higher  modulus).

2) Damage rates / creep-fatigue characteristics are also different for  the
two alloys.

One way to get rid of possible confusions (and the risky apple to oranges
comparisons) is simply to forget about SnPb and just focus on assessing the
reliability of SAC products, which is what we were doing in the days of
SnPb
when there was no predecessor to compare to.  Upfront, I  have absolutely no
worry when SAC test results are inferior to SnPb results, the  reason being
that
they may still be good enough.  The only thing i have to  demonstrate to my
customers is that their SAC assemblies meet their reliability  requirements.
If
they don't, it's another story and we have to go back to  the drawing board.

All the best,
Jean-Paul



In a message dated 2/21/2006 8:17:32 P.M. Eastern Standard Time,
[log in to unmask] writes:

Hi  John,
You say:
> If you apply that same test to a lead free identical  assembly it will
> tell you whether the unit is going to be more or less  reliable given
> enough samples, but that is about it. It will not tell  you whether tin
> whiskers will kill the product etc.
>
That is  actually not true, unless you run the product in actual
operational
conditions. As soon as you do any acceleration, you have an  apples/orages
comparison.

Werner






Quote of the month:

"I can calculate the  motion of heavenly bodies, but not the madness of
people",
Isaac  Newton.
_______________________________________________
Jean-Paul  Clech

EPSI Inc., P.O. Box 1522, Montclair, NJ 07042, USA
tel.:+1  (973)746-3796, fax: +1 (973)655-0815

_http://www.jpclech.com_ (http://www.jpclech.com/)

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