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February 2006

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Subject:
From:
Shawn Vike <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Tue, 21 Feb 2006 13:51:47 -0700
Content-Type:
text/plain
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text/plain (96 lines)
Genny,

You actually have to fight the Federal GVMT on this. NO one is supposed to
leave SASK for anywhere enjoyable at ANY TIME.

or so they tell us in Alberta!


 >>  I guess I don't understand #3.  once it fails, isn't it failed...?
 >>  I should be able to see a failure if my product no longer operates the
 >>  way it should, if I am using real devices...?

 >>  I've been asking if I could go to the workshop, but,...I don't know.
 >>  They (the people holding the money) don't seem to want to let me leave
 >>  cold SK, Canada for someplace I might actually enjoy being in March...

 >>  I am reviewing SM-785 right now, and may have further questions in a
 >>  little while.

 >>  -----Original Message-----
 >>  From: Leadfree [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
 >>  Sent: 20-Feb-06 9:14 PM

 >>  --snip--
 >>  Second, MIL-HDBK-217 is utterly useless as far as solder joint
 >>  reliability is concerned.
 >>  Third, ATC [accelerated temperature cycling] of actual product is rather
 >>  time consuming because you may not know when failures have
 >>  occurred-remember, solder joint failures show up as very short-duration
 >>  intermittents.
 >>  ...

 >>  By the way, you may want to attend my LF-Soldering Reliability Issues
 >>  workshop at the IPC/JEDEC conference in Santa Clara on March 7, and
 >>  perhaps the first
 >>  3 SJ Reliability Series parts on March 6 as well.

 >>  Werner

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 >>  !DSPAM:43fb816625161418658711!









Shawn Vike
Operations Manager

Pathway Connectivity Inc.
103, 1439 17th Avenue S.E.
Calgary, AB T2G 1J9
Canada

phone     403-243-8110 (ext 78)
fax     403-287-1281

[log in to unmask]

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