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Date: | Fri, 24 Feb 2006 16:25:41 -0500 |
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Marcello,
Is this voids in the solder paste after assembly or voids in the board for
the sequential laminations? Have you seen the Solectron paper on HDI VIP
voids as a function of blind-via placement and final finish?
Happy Holden
Asian Pacific Materials
Marcello Brett Malteze <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
02/24/2006 03:40 PM
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[TN] Via in Pad x Voids on Solder Process
Hey Team,
We are facing some problems regarding voids on Via in Pad on a 10
layers
board with sequential lamination ( 3 times inside press) on BGA area ,
someone can give me light or share your experience on this?
Board Spec:
Dielectric 2 x 106 = 90 - 100 µm final
YAG machine
O/L Copper 12 µm
Laser Diameter 130 µm
Surface finish Immersion Tin
Sometimes Voids are so big that are creating shorts under BGA.
Marcello Brett Malteze
Mechanical Process Engineering
Mobile: + 55 11 9468 4833
Skype: mbrett73
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