Subject: | |
From: | |
Reply To: | |
Date: | Thu, 16 Feb 2006 08:32:34 -0500 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Hi Dominic:
It should not cost you much to find out what is the temperature
of a board through reflow. The investment of buying a Mole or other
similar device, that will allow you to record the profile of a board
through an oven is only "once". If you are using eutectic solder and
your coldest components sees 20 degrees over the melting point which is
203 C and you are not exceeding the highest temp that the most
sensitive component may withstand, then you have a working profile, that
simple.
Regards,
Ramon
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dominic Boudreau
Sent: Wednesday, February 15, 2006 5:50 PM
To: [log in to unmask]
Subject: [TN] BGA Reflow profile - Thermocouples
Hello Techneter's,
I am working on a procedure to make the reflow profile of a PCB.
What are the techniques to know where to attach the thermocouples on the
"PCB"? I already know that it should be where we have the coldest and
hottest spot but is it possible to know when we "must" test a BGA to
have a better reflow profile. We are a little company so we don't have
the money to test a BGA each time we have one on a PCB.
Thank you
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e To
unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to [log in to unmask]: SET
Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
posts: send e-mail to [log in to unmask]: SET Technet Digest Search the
archives of previous posts at: http://listserv.ipc.org/archives Please
visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|