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Happy,
he is using flex...that is polyimide (known as kapton). The k=3.0-3.6 if my
old memory is correct...did I miss something? pardon...
jk
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Happy Holden
Sent: Tuesday, February 14, 2006 4:24 PM
To: [log in to unmask]
Subject: Re: [TN] Impedance Spec +/-5% and Cpk of 1.33
Glenn,
If you look at the nominals of variables and their tolerances that make up
the industry std. +/- 10% on impedances, to get to +/- 5% of SE 50 ohms or
DIFF 100 ohms TAKES a lot of improvements on all fronts, as the other
emails detail. Under special circumstances (like sorting materials) the
+/- 5% or 2.5 ohms for a SE 50 ohms can be reached (we did it for RamBuss
at 28 ohms) but is will NOT be robust or a volume production process-just
HAND CRAFTED ! Not to mention the difficulty in using a TDR to an
accuracy of +/- 5%
Note Fabrication Factors For +/- 5 ohms For +/- 2.5 ohms
For normal Products For MemBus
*1 Core thickness +/- 0.5 mil +/- 0.3 mil
*2 Resin Content 50 +/- 3 % 50 +/- 2.5 %
*3 Board thickness +/- 3 mil +/- 2 mil
after Lamination
*4 Di-electric constant 4.4 +/- 0.3 4.4 +/- 0.2
*5 Trace width control +/- 0.8 mil +/- 0.5 mil
*6 Cu thickness control +/- 0.5 mil +/- 0.3 mil
*7 S/M thickness +/- 0.3 mil +/-
0.3 mil
Happy Holden
Asian Pacific Materials
Glenn Pelkey <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
02/14/2006 02:05 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
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Subject
[TN] Impedance Spec +/-5% and Cpk of 1.33
Hi folks,
Is the industry capable of this requirement?
Impedance +/-5% with a demonstrated Cpk of 1.33.
This could apply to Single Ended 50 ohms or 100 ohms Differential.
Also, this is on a Flex Circuit.
Thanks,
Glenn
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