Hello all,



As more and more devices are coming in a LGA packaging format I am
wondering regarding the reliability of the interconnect. I did not found
a clear opinion and definite results in papers dealing with this issue.
More of that, some companies sending the package as "BGA ready" (meant
that you put later on a BGA solder balls) while other recommends to
direct assemble the device. Even more confusing is the fact that some of
the pads are rectangle while others are round.

Does someone have more data regarding the reliability and process for
this packaging type (assuming a device size of 15x15 mm)?



Thanks and happy New Year,



Dr. Gil Zilber

Elta system Ltd.




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