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January 2006

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Subject:
From:
Happy Holden <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 31 Jan 2006 12:36:36 -0500
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Michael,
The available nondestructive techniques are XRF, beta-backscatter,
resistance, eddy current, Hall-Effect (magnetic) and Induction Probe.  The
first three can measure the gold under the photoresist but not the
photoresist, the latter 3 can measure the photoresist over gold.  At these
thicknesses, cross-sections are very difficult.
Happy Holden
Asian Pacific Materials



Michael McMonagle <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
01/31/2006 11:46 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Michael McMonagle <[log in to unmask]>


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Subject
[TN] Au & Photoresist Thickness Measurement






I have been thrown an interesting question that I cannot answer, so I'll
toss it out here for y'all to ponder. We are looking for a way to measure
the thickness of gold and photoresist on a ceramic substrate. The test
needs
to be non-destructive for use as an in-process production test, measuring
gold in the range of 5 microns covered with photoresist in the range of
3-6
microns. Any inputs greatly appreciated, thanks..



Mike McMonagle
Quality Manager
OYO Geospace
7007 Pinemont Drive
Houston, TX 77040
Ph 713-986-8650
Fx 713-986-8725




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