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January 2006

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Subject:
From:
Phil Nutting <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Phil Nutting <[log in to unmask]>
Date:
Tue, 31 Jan 2006 11:31:53 -0500
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Good morning,
 
We have some designs that are calling for large, 1825 and 2225
components.  We have seen some mechanical failures where the parts have
cracked.  If we need to use these monster components, how do we ensure
we reduce or eliminate the mechanical failures.
 
Our failures were seen on a 16 inch by 17 inch 0.062 thick board.  On
these we have changed our handling methods.
 
On smaller 2 inch by 2 inch boards is this a don't care?  I know that
rapid temperature ramp up or down in the reflow process could be a
killer.  Something to work out with our CM.
 
Phil

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