Slowing down the wave, so that the wave does not hit the board
so fast by decreasing the speed of the chains or board carrier.

         

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ted Tontis
Sent: Monday, January 30, 2006 4:45 PM
To: [log in to unmask]
Subject: Re: [TN] Optimum dia of thru-holes

Jon,
        If your product is not class three and you are getting at least
180 degrees on the solder side 75% vertical fillet 270 degrees on the
secondary side (270 degrees around the lead) and 75% of solder on the
pad on the secondary side you should be fine.	

        If you require class three then it would be 270 degrees on the
solder side, 75% vertical fillet, 330 degrees on the secondary side (330
degrees around the lead) and 75% of solder on the pad on the secondary
side.

        That's from A-610 Rev C. 

        If you are still not getting the flow you want try adjusting the
speed of the wave. Lead free solder doesn't flow well so slowing down
the wave and allowing the solder time to wick, will increase the volume
of solder on the primary side of the PCB. 

Good luck,

Ted

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