Jon,
There are slides available from Cookson about Lead-Free Wave soldering
that may have information about the FHS for LF axial parts.  Most
indications is that the FHS does not change.  Big difference is the LF
solder does NOT wick up the hole so you have voids near the surface.  The
various lectures on the topic say you have to insert LF solder fillets on
the component side in order to have a filled hole.  You may be using
'pin-in-paste' SMT assembly for this board, in that case the FHS does not
have to be changed.

Happy Holden
Westwood Associates


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jon McDowell
Sent: Monday, January 30, 2006 1:08 PM
To: [log in to unmask]
Subject: [TN] Optimum dia of thru-holes

Group

I recently sent the message below, and would like to ask another
question.  For SAC305 what is the optimum over sizing of though holes,
as compared to the lead diameter.






Hello group

My name is Jon McDowell, and I work as a Quality Technician at ECCO in
Boise ID. We manufacture back-up warning alarms for the auto/truck
industries.

I have a question for you.

We are using the Pansert AVKII through hole insertion machine, which
call out that the diameter for through holes be .020 larger than the
upper tolerance of the wire diameter being inserted in that hole.

However I have been informed that a hole which is .020 over the lead
diameter may cause problems with soldering, particularly with the SAC95
solder. Can anyone advise on this.

Thank You
Jon McDowell
Electronic Controls Co (ECCO)
833 W Diamond St
Boise Id 83705
P 208 395-8025

-----------------------------------------------------


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