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January 2006

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Subject:
From:
George Milad <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 27 Jan 2006 15:22:44 EST
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Victor,

ENEPIG has been around for a long time. Its popularity has never taken off
because of the high cost of Pd at the time it was launched.

There was always a question about the solder joint reliability of this
finish when used with eutectic solder. Pd does not form intermetallics with the  Pb.


Today Pd price is well below gold and it makes sense to re-evaluate the
viability of the finish.

Unlike ENIG where an immersion gold is deposited over the Ni, Palladium is
deposited chemically (electroless, not immersion), this precludes any chance of
 Ni corrosion.


The presence of Pd in the solder joint interface prevents the excessive
propagation of the thickness of the IMC, and gives rise to a very superior  solder
joint with SAC3o5 alloy

The recommended thicknesses are 120 -240 uins of Ni, 5-8 uins  of Pd and 1-2
uins of gold.

Best  regards

George Milad
[log in to unmask]
National Accounts Manager  for Technology
Uyemura International Corporation
Technical Center
240  Town LIne Rd
Southington CT 06489
(516) 901 3874 (mobile)
(860)  793-4011 (office)
(860) 793-4020 (fax)

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