George,
   Can you share the information regarding the ENEPIG surface finish.
I had not heard of this process.   Who developed this and how long in
use.?

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of George Milad
Sent: Thursday, January 26, 2006 4:28 PM
To: [log in to unmask]
Subject: Re: [TN] Immersion Gold and LF PROCESS

ENIG is a viable surface finish for lead free, data was presented at the
LF
conference on the solder joint reliability of this finish with SA 305
alloy.
DIG direct immersion gold is the direct deposition of 2 micro-inches of
gold
on copper.
Of course Immersion silver, immersion Tin and OSP are equally viable.
A unique surface finish that gave the most reliable solder joint with
SAC
305 alloy was ENEPIG electroless Ni electroless Pd with Immersion Gold.


Best  regards

George Milad
[log in to unmask]
National Accounts Manager  for Technology
Uyemura International Corporation
Technical Center
240  Town LIne Rd
Southington CT 06489
(516) 901 3874 (mobile)
(860)  793-4011 (office)
(860) 793-4020 (fax)

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