TECHNET Archives

January 2006

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
George Milad <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 26 Jan 2006 17:28:10 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (32 lines)
ENIG is a viable surface finish for lead free, data was presented at the LF
conference on the solder joint reliability of this finish with SA 305  alloy.
DIG direct immersion gold is the direct deposition of 2 micro-inches of  gold
on copper.
Of course Immersion silver, immersion Tin and OSP are equally viable.
A unique surface finish that gave the most reliable solder joint with SAC
305 alloy was ENEPIG electroless Ni electroless Pd with Immersion Gold.


Best  regards

George Milad
[log in to unmask]
National Accounts Manager  for Technology
Uyemura International Corporation
Technical Center
240  Town LIne Rd
Southington CT 06489
(516) 901 3874 (mobile)
(860)  793-4011 (office)
(860) 793-4020 (fax)

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2