It appears to be a raw board defect and is likely formed as part of the process for making the pad so the minimum annular ring requirements apply. If you have a good solder connection for 360D, the condition should be acceptable as is.
Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED
76 Technology Drive - POB 1890
Brattleboro, Vermont 05302
Voice - 802.257.4571 ext 37
Fax - 802.257.0011
<http://www.vtcircuits.com/>
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stephen Gregory
Sent: Wednesday, January 25, 2006 3:09 PM
To: [log in to unmask]
Subject: [TN] Pad Damage, Leave it alone, or fix it?
Afternoon All,
Today we had one of our final inspectors spot something on a board that was
getting ready to ship, that I'd like for you all to look at and offer an opinion if you would...BTW, the board has been tested and coated (with urethane).
Anyways, our inspector spotted a pad on the backside of a connector lead that looks like it has a piece of it missing. Take a look at:
http://stevezeva.homestead.com/files/Pad_Damage.jpg
and:
http://stevezeva.homestead.com/files/Pad_Damage_2.jpg
Not really sure if the board was like that from the beginning, or if it happened possibly during the lead clipping step just before wave solder. Bottom-line is that we've spotted it. Of course our customer is going to have the final say on what we are to do about it, but I'd like your opinion on the problem.
The -610 says at 10.2.9.3 that damage to a conductor/land is a defect, cut and dried. But then there is the practical side...
Does this look bad enough that you would go through all the hassle of having to strip the coating, remove the connector, and repair the pad? Do you think that the performance is compromised with this issue?
Just curious what you all think...
Stephen Gregory
Senior Process Engineer
LaBarge Incorporated
Tulsa, OK 74146
(918) 459-2285
(918) 459-2350 FAX
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
