Rick,

It is also possible depending on the size of the board and the amount of normal bow that occurs when processing - you may choose to use a high temp. chip bonding adhesive (Loctite #4204). In cases where the board bow is high and normal WS masking will crack, we have chosen to do this as well. The higher temp. bonder will hold up to the wave process temperatures and keep the component flush to the substrate - being a Cyanoacrylate it also cures very fast. The only issue with this is will your customer(s) allow a visible bonder on the completed CCA and the other is that the operators who applies the material has to be very careful not to get the bonder on solderable metallurgy areas of the substrate or it will not solder (and of course not too much as this will leave noticeable rings). A few of our customer will not allow this, but quite a few have allowed us to put this material on the approved materials listing.

Add another option of possibilities to your list... Hope this helps.

CAS

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Bloomquist, Ken
Sent: Wednesday, January 25, 2006 11:38 AM
To: [log in to unmask]
Subject: Re: [TN] Soldering Weights


Hi Rick,

Back when we were wave soldering we used water soluble temporary solder
mask. Dribble some along the side of the part and onto the PWB. When it
cures it will hold the part down. It comes off in the wash and you don't
have to deal with bags of shot going through the machine and all the
handling.

KennyB

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Todd, Richard
> Sent: Wednesday, January 25, 2006 9:24 AM
> To: [log in to unmask]
> Subject: [TN] Soldering Weights
>
> Does anyone know where I can get soldering weights for
> holding components down when going over the wave?
> Specifically, I need a very small weight for holding down a
> small radially-inserted switch which tends to float in the
> wave.  Maybe a small bag of shot?
>
> Any information and/or assistance is appreciated.
>
>
>
> Regards,
>
>
>
> Rick Todd
>
> Senior Engineer
>
> Process Quality Engineering
>
>
>
> Panasonic Automotive Systems Company of America
>
> Division of Panasonic Corporation of North America
>
> 776 Highway 74 South, Peachtree City, GA 30269
>
> 770-515-1087 Direct
>
> 678-458-2887 Cell
>
> 770-486-2218 Fax
>
> [log in to unmask] <mailto:[log in to unmask]>

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------