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January 2006

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Subject:
From:
"Kane, Amol (349)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Kane, Amol (349)
Date:
Tue, 24 Jan 2006 15:03:10 -0500
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Hi Werner,
Why do you say that the components cannot be dried in a desiccant cabinet? All the desiccant storage cabinet manufacturers give you a time where the moisture in a component falls below acceptable level (usually <0.1% by wt ), or is that just theoretical and does not work?

I have seen ppl drying components that have exceed floor life in these desiccator cabinets

Amol Kane
M.S (Industrial Eng.)
Process Engineer
Harvard Custom Manufacturing 
941 Route 38  Owego, NY 13827
Phone: (607) 687-7669 x349
[log in to unmask]

 -----Original Message-----
From:   TechNet [mailto:[log in to unmask]]  On Behalf Of Werner Engelmaier
Sent:   Tuesday, January 24, 2006 1:09 PM
To:     [log in to unmask]
Subject:        Re: [TN] baking moisture sensitive components

Hi 'ybrisson,'
> If the component is past floor life can I just put it in a dry cabinet?  
> A: No, the moisture needs to be actively removed.
> 
> What wil be the time before I'll be ready to either use it or seal it?  
> A: Depends on whether you Bake, Bake-Dry, or Dry.
> 
> I know it depend on the MSL but in the IPC/JEDEC document there use 
> something around 125degree. 
> A: Yes, it depends on the MSL--105 to 125C is a Bake.
>  
> A dry cabinet it's at room temperature no?
> A: Yes, but it is only for storage, you cannot actively dry at RT.
>   
> or is there something which combine a dry cabinet and baking? 
> A: That is a Bake-Dry or a Dry.
>  
> And if we use baking do we need dry cabinet? 
> A: Dependson how long after removal from the chamber you intent on using the 
> part.
> 
> or can we just seal it or use it directly after baking? 
> A: Yes and yes.
>  
> and after that how do you manage your component?
>  A: Keep rtham dry.

Werner

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