Hi Victor! A significant number of companies (including Rockwell Collins)
have conducted a wide variety of Pbfree soldering process test vehicles
using Pbfree HASL, immersion tin, immersion silver, OSP,  and ENIG pwb
surface finishes. All of these finishes have been show to create
metallurgically sound solder joints that are reliable in a number of
different use environments. And all of the finishes have their own
advantages/disadvantages: immersion tin has poor thermal excursion
robustness, immersion silver has specific packaging needs, ENIG can be
sensitive to the reflow profile due to slower IMC formation, OSP has
limited thermal robustness, and Pbfree HASL can have coplanarity issues if
not process correctly. All of the finishes have been shown to be compatible
with Pbfree solder processing and produce good solder joint integrity
provided you utilize good process controls and start with a correctly
applied pwb finish. Do you have a more specific question on one of the
finishes?

Dave Hillman
Rockwell Collins
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             "Victor G.
             Hernandez"
             <Victor_G_Hernand                                          To
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                                                                   Subject
                                       [TN] Immersion Gold and LF PROCESS
             01/24/2006 11:49
             AM


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Fellow TechNetters:

   Can someone share any reliability data they have come across with
regards to a sound
metallurgical solder joint with regards to IAu and LF Process?

Victor,

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