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January 2006

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Subject:
From:
Gerard O'Brien <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gerard O'Brien <[log in to unmask]>
Date:
Tue, 24 Jan 2006 13:18:26 -0500
Content-Type:
text/plain
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text/plain (52 lines)
Victor - as part of a Pb-free consortia back in 1999/2000, we tested ENIG
with multiple surface finishes on components and different alloys. Parts
were thermally cycled from -55C to 125C for 1000 hours. Data was published
at IPC fall show in Miami - cannot remember the year but I am sure someone
on the net does.


Regards


Gerard O'Brien
Photocircuits Corporation


-----Original Message-----
From: Victor G. Hernandez [mailto:[log in to unmask]]
Sent: Tuesday, January 24, 2006 12:50 PM
To: [log in to unmask]
Subject: [TN] Immersion Gold and LF PROCESS

Fellow TechNetters:

   Can someone share any reliability data they have come across with
regards to a sound
metallurgical solder joint with regards to IAu and LF Process?

Victor,

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