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January 2006

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Subject:
Re: baking moisture sensitive components
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Tue, 24 Jan 2006 10:41:17 -0600
Content-Type:
text/plain
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text/plain (44 lines) 
The drying can be accomplished in a dessicator at room temperature, such
as a McDry system. This takes a little longer, but if you use a
dessicator as combination storage and drying system, it works very well
to keep the components dry. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Tuesday, January 24, 2006 10:22 AM
To: [log in to unmask]
Subject: Re: [TN] baking moisture sensitive components

Hi Bob,
Yes, there are documents and guidelines: IPC/JEDEC J-STD-033B &
J-STD-020D, and T. Sack & L. Scala of Celestica have published
guidelines for bBaking (typically at 125C), Bake-Drying (typically at
90C), and Drying (typically at 40C).
The durations vary according to the MSL Levels form 21 to 48 hours for
Baking, 3 to 8 days for Bake-Drying, and 29 to 79 days for Drying.

Werner

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