Hi All,

I have some questions concerning the baking of moisture sensitive  components.

Are there any general guidelines you follow regarding the amount of
time/temperature required to properly bake components or PCB assemblies prior to
component assembly or rework? I've seen articles speak of 12, 24 or 48 hour  bakes
at 125 C.

Also, can anyone recommend a small table top type oven to perform the  baking
with? I've heard some people use a regular old toaster oven with success,
but I might be concerned about the temperature control capability of such an
oven. I work in a small PCB prototype environment where the boards may be up to
14" x 10" in size. I might need to prep 1 or 2 PCB assemblies along with
maybe 6  BGA's (40mm x 40mm) at a time with the oven.

I'd greatly appreciate any recommendations or additional comments on the
subject.

Regards,
Bob Walker
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