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January 2006

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Subject:
From:
John Burke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Burke <[log in to unmask]>
Date:
Mon, 23 Jan 2006 14:12:59 -0800
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Thanks Happy, good point,

That would work, but I would end up using a single 0.0027 prepreg.

Here is the current stack up attached, if I leave the copper as is (1/2
oz all internal) and use 5 x 0.0027 will that still be stable/reliable
in BT?

John

John Burke
Senior Manager - Operations , Optichron
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W: 510 249 5233
M: 408 515 4992
http://www.optichron.com
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Happy Holden
Sent: Saturday, January 21, 2006 6:40 AM
To: [log in to unmask]
Subject: Re: [TN] Laminate material

John,
Why not consider BT, which is what most BGAs are made from?  It comes in
a
variety of thicknesses and prepregs, has a very high Tg & Td, and is
very
flat and smooth.
Happy Holden
Asian Pacific Materials




John Burke <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
01/20/2006 06:25 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
John Burke <[log in to unmask]>


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Subject
[TN] Laminate material






I am using a standard 0.62 thick laminate 6 layers. The board size is
1.375 by 2 inches. It is a lead free assembly and is a little unusual in
that it has BGA and QFP components on the top, but is mounted with 300+
bga balls on the reverse side, so in effect is actually a component when
finished.

I am making this out of Polyclad 370HR, and have no coplanarity issues
with the finished product.

I have a request though to make the product thinner for one customer
application.

Anyone have suggestions on a material that could be mechanically stable
enough to reduce the current board thickness in order to achieve this -
as I said it needs BGA flatness and is assembled at 260 C twice by us
(components and ball attach) and once by the customer.

Thanks in advance,

John

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