Hi Eddie,

When do you find the voids?  After fabrication, after assembly (temp), after
solder float (temp) are they visible before microsectioning, what type of
material etc.?

Sincerely,

Paul Reid


Program Coordinator
PWB Interconnect Solutions Inc.

Tel:  613-596-4244 Ext. 229
Fax: 613-596-2200


-----Original Message-----
From: Eddie Rocha [mailto:[log in to unmask]]
Sent: Wednesday, December 28, 2005 3:46 PM
To: [log in to unmask]
Subject: [TN] (PCB fabrication) Lam Voids


I'm getting "LAM VOIDS" on a 16 layer board that we build.
The board is .140" thick and has 2 oz copper on layers 2,
8, 9, and 15. Any ideas on what might be causing these "LAM
VOIDS". The "lam voids" are about .004" x .010" in size and
x-sections show them between different layers such as the
surface of layers 2, 6, and 11.

I just began looking into this issue so I'll appreciate any
ideas.

Thank you,

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------