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January 2006

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Subject:
From:
"Dehoyos, Ramon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dehoyos, Ramon
Date:
Mon, 23 Jan 2006 08:23:21 -0500
Content-Type:
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        Ioan:
        Another option that is available is the combination of routing
and V scoring the boards in a panel  by the board fabricator. That way
the tabs will be a lot easier to break and the stress will be minimized
by exerting the force on the  middle layers.
        Regards,
        Ramon
         

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gerald Gagnon
Sent: Saturday, January 21, 2006 1:02 PM
To: [log in to unmask]
Subject: Re: [TN] Panelization of backplanes

Ioan,

Probably late with the reply.

Get the boards routed to finished circuit size and deal with only the
assembly issues thereafter.

Other "break away" type singulation methods do not work well for these
boards. You will be placing stresses on components. You will find that
you will also be doing a lot of edge repairs unless you want to do the
"machining" after assembly with specialized equipment you can buy for
this task.

Post assembly routing is an option. I have heard of water-jet cutting as
well. Beware of stresses you will be placing on your components and
connectors as well as all the debris you will generate.

All these things puts the risk on you after you have added all the value
through assembly.


Good luck

Gerry


From: "Tempea, Ioan" <[log in to unmask]>
Reply-To: TechNet E-Mail Forum <[log in to unmask]>,              "Tempea,
Ioan" <[log in to unmask]>
To: [log in to unmask]
Subject: [TN] Panelization of backplanes
Date: Thu, 19 Jan 2006 15:37:58 -0500

Hi Technos,

I have a few 2.5"x18" PCBs here that are 0.236" thick. Among the
pressfit connectors there also are some SMT passives, so I need to pass
them on the assembly line.

Can I panelize boards of this thickness? Is V-scoring an option?

Thanks,
Ioan

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