George,
Interesting comment!
Can you elaborate?
Gerry
From: "Wenger, George M." <[log in to unmask]>
Reply-To: TechNet E-Mail Forum <[log in to unmask]>, "Wenger,
George M." <[log in to unmask]>
To: [log in to unmask]
Subject: Re: [TN] RoHS board finish
Date: Wed, 18 Jan 2006 15:08:13 -0500
Depending on the ISn thickness and reflow temperature you could be
soldering to Sn not Cu when using ISn.
Regards,
George
George M. Wenger
Reliability / FMA Engineer
Base Station and Subsystems Group
Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Wednesday, January 18, 2006 3:00 PM
To: [log in to unmask]
Subject: Re: [TN] RoHS board finish
Hi Amol,
There is no reason that you should see a difference in accelerated
thermal cycling and/or long-term reliability if using immersion Ag and
Sn. In both the iAg and iSn surface treatments, you are soldering to the
underlying Cu.
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com
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