I am using a standard 0.62 thick laminate 6 layers. The board size is
1.375 by 2 inches. It is a lead free assembly and is a little unusual in
that it has BGA and QFP components on the top, but is mounted with 300+
bga balls on the reverse side, so in effect is actually a component when
finished.

I am making this out of Polyclad 370HR, and have no coplanarity issues
with the finished product.

I have a request though to make the product thinner for one customer
application.

Anyone have suggestions on a material that could be mechanically stable
enough to reduce the current board thickness in order to achieve this -
as I said it needs BGA flatness and is assembled at 260 C twice by us
(components and ball attach) and once by the customer.

Thanks in advance,

John

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