I have an application where we are forced to add solder to pads after paste
printing to ensure a good fillet.  We have opened up the apertures as much
as the surrounding parts will allow and due to 0402's near by increasing the
paste height with the stencil is not practical.

My questions concern solder preforms as I have never seen them used.  One of
the components to be placed is a cylindrical surface mount fuse with three
rectangular pads measuring about .125" x .375".  Can someone please explain
how the process works?  Is the preform placed in the paste after printing?
Are they tape and real for automated placement?  What holds the component on
the preform during any handling that might be required prior to reflow?  We
are building in volume so the objective is to reduce the operator variable
and additional handling.

Any comments, expertise, or quirks would be greatly appreciated.

Regards,
Martin Butcher,
Process Engineering

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