Dear TechNetters,

We are just starting our journey into lead-free (we are currently covered
under Article 9, but we can see the handwriting on the wall), and we are
starting to deal with some issues as suppliers are making component changes
to comply with RoHS. The component at issue is a heat sink for a TO-220
transistor. Flux is 2% no-clean. Solderability is not good; partial solder
adhesion (about 20-30%) on the mounting tabs. 90% coverage is required by
standards.  The matte tin finish appears to have a white deposit that can be
removed by either scraping or cleaning with a mild solvent. Vendor says this
is normal and should not affect solderability.

Thoughts?

John Burris

Automated Logic

1150 Roberts Blvd.

Kennesaw, GA 30144-3618

01.770.795.4827 (Office)

01.770.795.3527 (Facimile)

01.404.431.9109 (Cellular)




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