Question(s),

I am about to build a double sided SMT board using lead free parts and eutectic solder paste, the only concern I have is that there is one lead free BGA on the board. I do not know at what temperature the balls will start to collapse (what is the normal alloy of a PB free BGA)?? AND what happens if anything to the eutectic solder if I drive the reflow temps to the needs of the BGA? Will the intermixing of the two different alloys be an issue for reliability? Would you treat this BGA like a hi temp leaded BGA and ADD solder paste volume to the land pads?

A second question is, I have a different customer that wants a eutectic BGA replaced with its PB free counterpart. Can I use just tacky flux and drive the profile hotter to get the balls to a liquidous state and get good wetting/solder joints.

Your experiences would be a huge help

Thanks
*************************************************************************
Royce Taylor
Process Engineering/Production
Suntron Corporation NEO
104 Glenn Street
Lawrence, MA 01843
(978)747-2061 voice
(978)747-2010 fax
[log in to unmask]

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