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January 2006

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Subject:
Plugged via issue
From:
Wee Mei <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wee Mei <[log in to unmask]>
Date:
Thu, 19 Jan 2006 11:45:48 +0800
Content-Type:
text/plain
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text/plain (18 lines) 
Hello,

Recently I took over the inspection of bare boards and noticed that the vias
are plugged with solder mask and some has small drop overflow on the pad
surface. Some of the SMD packages have via-on-pads with 0.3mm diameter via.
I cam concerned about solder reliability. The via diameter is 0.3mm and
during fabrication, they are pluged with solder mask.

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