Yes, it will be eliminated at the solder area, due to
the fact that Sn is no longer pure, > 3% of other metals. The concern
still exists at the terminal source where there is no solder of any
kind. Whiskers may still grow there and either short out with adjacent
terminals or break out and short leads by bridging them.
Regards,
Ramon
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Amol (349)
Sent: Wednesday, January 18, 2006 2:54 PM
To: [log in to unmask]
Subject: Re: [TN] RoHS board finish
...on a related issue.....any thoughts about Sn whiskering propensity of
Immersion Sn finish? My knowledge base seems to tell me that Immersion
Sn is popular in Europe and to date has no evidence (published) of tin
whiskering due to the finish....another train of though is that if you
solder the surface that's coated with Immersion Sn, then the whiskering
propensity (if any) of Immersion Sn finish is eliminated
Any thoughts???
Amol Kane
M.S (Industrial Eng.)
Process Engineer
Harvard Custom Manufacturing
941 Route 38 Owego, NY 13827
Phone: (607) 687-7669 x349
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Amol (349)
Sent: Wednesday, January 18, 2006 2:49 PM
To: [log in to unmask]
Subject: Re: [TN] RoHS board finish
Hi,
We are experimenting with Immersion Ag and Sn......and so far both of
these finishes seem to be at par in terms of solderability, and time
zero shear and pull testing results. Accelerated thermal cycling is
being performed to see long term reliability.
Amol Kane
M.S (Industrial Eng.)
Process Engineer
Harvard Custom Manufacturing
941 Route 38 Owego, NY 13827
Phone: (607) 687-7669 x349
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard
D.
Sent: Wednesday, January 18, 2006 2:26 PM
To: [log in to unmask]
Subject: Re: [TN] RoHS board finish
Good words, John. I like "bullet-proof".
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Wednesday, January 18, 2006 11:55 AM
To: [log in to unmask]
Subject: Re: [TN] RoHS board finish
Polyclad 370HR finished in immersion silver will be pretty much bullet
proof.
Kind regards,
John Burke
John
John Burke
Senior Manager - Operations , Optichron
[log in to unmask]
W: 510 249 5233
M: 408 515 4992
http://www.optichron.com
Profile: https://www.linkedin.com/e/fps/2665502/
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Robert Walker
Sent: Wednesday, January 18, 2006 9:39 AM
To: [log in to unmask]
Subject: [TN] RoHS board finish
Hi All,
I'm doing my first PCB design that will use lead-free components and I
need to change my board finish from what I've always used.....HASL. I'm
looking for any recommendations or comments on the best board finish to
use.
The components used on the design will be a mixture of tin-lead and
lead-free (SAC), so I'm not sure if there is a preferred finish to use
in this type of situation. I work in a prototype environment where the
boards may be reworked (BGA removal/replaced) a number of times, so I'm
concerned about the ability of the finish being able to handle being
reworked/reflowed a number of times.
I'd also welcome any recommendations on the type of board material to
use since it will see an elevated temperature of up to 260C. I've always
just specified FR4 in the past.
Thanx in advance for any feedback.
Regards,
Bob Walker
[log in to unmask] (mailto:[log in to unmask])
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