Werner:
        Based on this, for surface and leaded component coated with SAC
solder, except the BGA balls, SnPb solder will solder fine to the
components and will eliminate Sn whiskers. Will it not? Or the Ag in SAC
is of a different type?
        Ramon

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Wednesday, January 18, 2006 3:00 PM
To: [log in to unmask]
Subject: Re: [TN] RoHS board finish

Hi Amol,
There is no reason that you should see a difference in accelerated
thermal cycling and/or long-term reliability if using immersion Ag and
Sn. In both the iAg and iSn surface treatments, you are soldering to the
underlying Cu.

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com


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