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January 2006

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Subject:
From:
Robert Walker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 18 Jan 2006 12:39:06 EST
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Hi All,

I'm doing my first PCB design that will use lead-free components and I need
to change my board finish from what I've always used.....HASL. I'm looking for
 any recommendations or comments on the best board finish to use.

The components used on the design will be a mixture of tin-lead and
lead-free (SAC), so I'm not sure if there is a preferred finish to use in this  type
of situation. I work in a prototype environment where the boards may be
reworked (BGA removal/replaced) a number of times, so I'm concerned about the
ability of the finish being able to handle being  reworked/reflowed a  number of
times.

I'd also welcome any recommendations on the type of board material to use
since it will see an elevated temperature of up to 260C. I've always just
specified FR4 in the past.

Thanx in advance for any feedback.

Regards,
Bob Walker
[log in to unmask] (mailto:[log in to unmask])

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