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January 2006

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Subject:
Re: ImAg Flaking away
From:
R Sedlak <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, R Sedlak <[log in to unmask]>
Date:
Wed, 18 Jan 2006 09:03:19 -0800
Content-Type:
text/plain
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text/plain (49 lines) 
Richard:

Having not seen it, but having an idea... I would bet that the problem is caused by soldermask "development issues"... I would bet that there remain soldermask residues on the edges, which get plated over, but which cause the plating to be non-adherent.

Does this fit the available data?

Rudy Sedlak
Richard Kraszewski <[log in to unmask]> wrote: Has anyone had any issues with ImAg breaking away from the perimeter of
a PTH?  We seem to be seeing this in a tin/lead selective soldering
operation after the board has already seen 2 previous reflows.



Any thoughts?



Rich K / KEDS




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